NVC presents unique World Review on Supply Chain Applications of RFID and Sensors in Packaging

Today NVC presented the NVC World Review on Supply Chain Applications of RFID and Sensors in Packaging. The report was presented during the Hi Europe Exhibition in Frankfurt, Germany. The presentation was well visited and there was a lot of interest in the report.
This unique report describes the potential of RFID and sensors in packaging for a wide range of supply chain applications and is the culmination of the NVC-activities in this field over the past decade. These include participation in the worldwide ISO standards development, a scientific study on RFID and sustainability as compared to conventional barcodes and the PASTEUR-project which succeeded in the development of an integrated chip-sensor technology platform for future supply chain applications.
If you are interested in receiving the report, please send an e-mail to Ger Standhardt, NVC manager Knowledge Development and Projects.